AI Infra · 芯片人才地图 · 美国AI Infra · Chip Talent Map · United States

这场算力战争,This compute war
是从英特尔出走的老兵,去抢 NVIDIA 锁在金手铐里那 1/7 的人is Intel veterans fanning out to hunt the 1/7 of NVIDIA's engineers locked behind golden handcuffs

我们透视了 15 家美国 AI 算力 / 芯片公司、56,861 名在册工程与研究人才,把他们的简历读成数据。结论不是"芯片缺人"这么简单:真正稀缺的是同时下得到硅、上得到模型的"双栈桥梁人"——他们即便在 NVIDIA 也只占约七分之一;而供给这群人的,是一座没人愿意承认的工厂:英特尔。We x-rayed 15 U.S. AI-compute / chip companies and 56,861 current engineering and research professionals, reading their résumés as data. The conclusion is more than "chips are short on people": what's truly scarce are the "dual-stack bridge people" who reach down to the silicon and up to the model alike — even at NVIDIA they're only about one in seven. And the factory supplying them is one nobody wants to admit to: Intel.

报告日期Report Date 2026-06-16 出品Produced By Metix AI 覆盖Coverage 15 家公司 · 美国15 companies · United States
Executive Summary

01核心结论Key Takeaways

以下数字为 Metix AI 数据库口径(数据时点约 2026 H1),统计对象 = 15 家美国 AI 算力 / 芯片公司的在册工程与研究人才(按权威 company_id 取在职、再按"硬件设计 + ML 系统"岗位口径清洗)。所有数字均为聚合统计,报告不展示任何个人信息。The figures below follow Metix AI database methodology (data as of roughly 2026 H1). The population = current engineering and research professionals at 15 U.S. AI-compute / chip companies (current employees pulled by authoritative company_id, then cleaned to a "hardware design + ML systems" role scope). All figures are aggregate statistics; the report displays no personal information.

56,861
在册芯片 / AI-infra 工程研究人才Current chip / AI-infra engineering & research professionals
15 家公司 · 美国 · 聚合可见样本15 companies · United States · aggregate visible sample
约 1 / 7~1 / 7
NVIDIA 工程师里的"双栈桥梁人""dual-stack bridge people" among NVIDIA engineers
14.6%;全图仅 8.4%(约 1/12)14.6%; just 8.4% across the full map (~1/12)
40 个月40 months
NVIDIA 核心中位在职任期NVIDIA core median current tenure
44% 已满 4 年,深度归属44% are past 4 years — deeply vested
9 / 14
以英特尔为头号人才来源的公司companies whose #1 talent feeder is Intel
含 NVIDIA、AMD 与多数挑战者including NVIDIA, AMD and most challengers
真正的战略物资是"双栈桥梁人"The real strategic asset is the "dual-stack bridge person"

同时懂物理硅(RTL / 验证 / 物理设计)与 ML 系统(CUDA / 编译器 / 内核)的人,是这场竞赛的硬通货。全图 56,861 人里仅People who understand both physical silicon (RTL / verification / physical design) and ML systems (CUDA / compilers / kernels) are the hard currency of this race. Of the 56,861 across the full map, only 8.4% 可识别为双栈,NVIDIA 也只有 are identifiable as dual-stack, and even NVIDIA has only 14.6%(约 1/7),传统芯片大厂近乎绝迹(博通 2.2%、英特尔 5.0%)。双栈密度,是一家公司"有多 AI 原生"的体温计。 (~1/7); at legacy chip giants they're nearly extinct (Broadcom 2.2%, Intel 5.0%). Dual-stack density is the thermometer of how AI-native a company really is.

英特尔是这场战争的"非自愿人才工厂"Intel is this war's "involuntary talent factory"

它是 14 家公司里It is, among the 14 other companies, the #1 talent feeder for 9 家9 of them的头号人才来源——NVIDIA 的 13%、AMD 的 21%、Rivos 的 32%、Tenstorrent 的 31% 都来自英特尔,且其中约 — 13% of NVIDIA, 21% of AMD, 32% of Rivos and 31% of Tenstorrent come from Intel, and of those roughly 89% 在英特尔做的就是技术岗。算力竞赛的地基,很大程度上是英特尔流出的资深工程师在搭。 held technical roles at Intel. The foundation of the compute race is, to a large degree, being laid by senior engineers who flowed out of Intel.

NVIDIA 是唯一的"留人堡垒"NVIDIA is the only "retention fortress"

大量进人、极少流出。在别家的人才来源里 NVIDIA 普遍只占 5–9%(唯一例外是 Groq,34%)。Massive inflow, minimal outflow. As a talent source for other companies, NVIDIA generally accounts for only 5–9% (the lone exception is Groq, at 34%).40 个月40 months中位任期 + NVDA 约十倍的股价 = 行业最硬的金手铐,把Median tenure + a roughly 10x move in NVDA stock = the hardest golden handcuffs in the industry, locking the 44% 的"4 年以上老兵"锁在原地。 of "4-years-plus veterans" in place.

每家挑战者的"血统"都写在简历里Every challenger's "lineage" is written in its résumés

可直接拿来源人:SambaNova = 甲骨文 / Sun(41%)、Rivos = 苹果芯片帮(被苹果起诉的那批)、Groq = 前 NVIDIA(34%)、AWS 自研芯片 Annapurna = 亚马逊内部转岗(54%)。读懂血统,就知道该去哪家挖哪种人。You can source straight from it: SambaNova = Oracle / Sun (41%), Rivos = the Apple-chip crew (the ones Apple sued), Groq = ex-NVIDIA (34%), AWS's in-house chip team Annapurna = internal Amazon transfers (54%). Read the lineage and you know which company to raid for which kind of engineer.

关于本报告。About this report. 覆盖 6 家芯片 / GPU 大厂(NVIDIA、AMD、博通、Marvell、高通、英特尔)+ 8 家 AI 加速器挑战者(Groq、Cerebras、SambaNova、Etched、Tenstorrent、d-Matrix、Lightmatter、Rivos)+ AWS 自研芯片团队 Annapurna。所有数字为聚合统计,不展示任何个人信息。同款透视可按需为任意目标公司生成;完整名单与候选人对接可经 Metix AI 平台。Covers 6 chip / GPU giants (NVIDIA, AMD, Broadcom, Marvell, Qualcomm, Intel) + 8 AI-accelerator challengers (Groq, Cerebras, SambaNova, Etched, Tenstorrent, d-Matrix, Lightmatter, Rivos) + AWS's in-house chip team Annapurna. All figures are aggregate statistics; no personal information is shown. The same x-ray can be generated on demand for any target company; full lists and candidate outreach are available through the Metix AI platform.
The Roster

02存量地图:体量在大厂,密度在初创Stock Map: scale lives at the giants, density at the startups

先看盘子。这 15 家公司在美国的在册工程与研究人才共 56,861 人,但分布极不均:6 家芯片 / GPU 大厂占了 55,478 人(Start with the pie. These 15 companies hold 56,861 current engineering and research professionals in the U.S., but the distribution is wildly uneven: the 6 chip / GPU giants account for 55,478 (97.6%),8 家挑战者合计只有 1,290 人。最刺眼的反差是——人最多的英特尔(21,549),AI 双栈密度却几乎垫底(5.0%)。), while the 8 challengers combined hold just 1,290. The starkest contrast: Intel, with the most people (21,549), sits near the bottom on AI dual-stack density (5.0%).

英特尔Intel
21,549 · 双栈 5.0%· dual-stack 5.0%
NVIDIA
12,134 · 双栈 14.6%· dual-stack 14.6%
高通Qualcomm
8,196 · 双栈 8.1%· dual-stack 8.1%
AMD
6,139 · 双栈 11.7%· dual-stack 11.7%
博通Broadcom
5,313 · 双栈 2.2%· dual-stack 2.2%
Marvell
2,147 · 双栈 5.2%· dual-stack 5.2%
8 家挑战者合计8 challengers combined
1,290 · 双栈 20.7%· dual-stack 20.7%
横条 = 在册工程研究人才数(美国,按权威 company_id + 岗位口径清洗)。紫色 = GPU 双雄,浅色 = 传统 / 网络 / 移动芯片厂,绿色 = AI 加速器挑战者。数据来源 Metix AIBars = count of current engineering & research professionals (U.S., cleaned by authoritative company_id + role scope). Purple = the GPU duo, light = legacy / networking / mobile chip makers, green = AI-accelerator challengers. Source: Metix AI

把每家公司拆成"偏硅(metal)/ 偏模型(model)/ 双栈"三类,画像立刻清晰:传统芯片厂是纯硬件军团,AI 初创则把天平往模型一侧拉。下面是完整花名册(中位任期 / 中位履历计算到报告日期)。Split each company into three buckets — "metal-leaning / model-leaning / dual-stack" — and the picture snaps into focus: legacy chip makers are pure-hardware battalions, while AI startups tilt the scales toward the model side. Below is the full roster (median tenure / median career computed to the report date).

公司Company阵营Camp工程研究人才Eng & research偏硅%Metal %偏模型%Model %双栈%Dual-stack %中位任期Median tenure中位履历Median career博士%PhD %
NVIDIAGPU 双雄GPU duo12,13451.531.514.640 月40 mo15.0 年15.0 yr14.1
AMDGPU 双雄GPU duo6,13967.216.711.736 月36 mo15.1 年15.1 yr10.8
英特尔Intel传统芯片Legacy chip21,54949.98.75.068 月68 mo16.5 年16.5 yr20.1
高通Qualcomm传统芯片Legacy chip8,19648.115.08.158 月58 mo15.8 年15.8 yr12.1
博通Broadcom传统芯片Legacy chip5,31342.04.82.290 月90 mo21.8 年21.8 yr9.9
Marvell传统芯片Legacy chip2,14765.26.25.251 月51 mo19.6 年19.6 yr11.1
SambaNova挑战者Challenger17961.545.326.848 月48 mo14.7 年14.7 yr6.7
Etched挑战者Challenger14177.327.021.312 月12 mo12.5 年12.5 yr8.5
Tenstorrent挑战者Challenger30484.526.321.116 月16 mo14.9 年14.9 yr12.5
Cerebras挑战者Challenger22249.139.619.824 月24 mo15.4 年15.4 yr15.8
d-Matrix挑战者Challenger8868.259.140.918 月18 mo15.5 年15.5 yr22.7
Lightmatter挑战者Challenger15778.317.812.717 月17 mo15.4 年15.4 yr30.6
Rivos挑战者Challenger14087.110.09.340 月40 mo13.8 年13.8 yr8.6
Groq挑战者Challenger5947.533.920.330 月30 mo16.7 年16.7 yr6.8
AWS Annapurna云自研Cloud in-house9371.059.141.919 月19 mo10.4 年10.4 yr15.1
体量与密度是错位的。Scale and density are out of sync. 挑战者的双栈密度(20.7%)是大厂(8.0%)的 2.6 倍——但大厂的人多 43 倍。把绝对数算出来:全图约 4,758 名可识别的双栈人才里,Challengers' dual-stack density (20.7%) is 2.6x that of the giants (8.0%) — but the giants have 43x more people. Run the absolute numbers: of the roughly 4,758 identifiable dual-stack professionals across the full map, 94% 仍坐在 6 家大厂内94% still sit inside the 6 giants,光 NVIDIA 一家就占 37%(约 1,770 人)。初创"含金量"高,但盘子小,只能在边际上抢,抢不过体量。, with NVIDIA alone accounting for 37% (~1,770 people). Startups are higher-grade ore, but the pie is small; they can fight at the margin, but not out-muscle the giants on scale.
The Scarce Prize

03双栈稀缺性:一道单调的"AI 原生"梯度Dual-Stack Scarcity: a monotonic "AI-native" gradient

把"双栈密度"按公司排开,会看到一条几乎完美单调的梯度:从只做网络 / 模拟芯片的博通(2.2%),一路爬到天生为大模型造芯片的 d-Matrix、AWS Annapurna(约 41%)。一家公司离大模型有多近,它的简历里就有多少"既懂硅又懂模型"的人。Line up "dual-stack density" by company and you get an almost perfectly monotonic gradient: from Broadcom (2.2%), which only does networking / analog chips, climbing all the way to d-Matrix and AWS Annapurna (~41%), built from the ground up to make chips for large models. The closer a company sits to large models, the more "understands both silicon and models" people its résumés contain.

各公司"双栈桥梁人"占比(硬件 ∩ ML 系统)Share of "dual-stack bridge people" by company (hardware ∩ ML systems)

博通Broadcom
2.2%
英特尔Intel
5.0%
Marvell
5.2%
高通Qualcomm
8.1%
AMD
11.7%
NVIDIA
14.6%
Cerebras
19.8%
Tenstorrent
21.1%
Etched
21.3%
SambaNova
26.8%
d-Matrix
40.9%
AWS Annapurna
41.9%
双栈 = 同一人的履历(在职 + 过往头衔 + 技能)里同时出现"模型"信号(ML / 深度学习 / PyTorch / NLP …)与"金属"信号(RTL / ASIC / 物理设计 / CUDA / 编译器 / 内核 / 互联 …)。数据来源 Metix AIDual-stack = the same person's history (current + past titles + skills) carries both a "model" signal (ML / deep learning / PyTorch / NLP …) and a "metal" signal (RTL / ASIC / physical design / CUDA / compilers / kernels / interconnect …). Source: Metix AI

三个梯队Three tiers

传统芯片厂Legacy chip makers 博通 / 英特尔 / Marvell / 高通 ≈Broadcom / Intel / Marvell / Qualcomm ≈ 2–8%。它们是纯硅军团(偏硅 42–65%,偏模型常个位数),双栈几乎绝迹。. They are pure-silicon battalions (metal-leaning 42–65%, model-leaning often single digits), with dual-stack all but extinct.

GPU 双雄GPU duo AMD / NVIDIA ≈ 12–15%。常年活在"GPU × ML"的交叉口,是大厂里双栈最厚的。. Living at the "GPU × ML" intersection for years, they carry the thickest dual-stack layer among the giants.

AI 加速器挑战者AI-accelerator challengers20–42%。为大模型而生,把模型一侧的人才比例拉到大厂的两三倍。. Built for large models, they pull the model-side talent share to two or three times that of the giants.

这是个"下限",但梯度是真的This is a "floor," but the gradient is real

双栈用关键词从自报头衔 + 技能里识别,Dual-stack is identified by keywords from self-reported titles + skills, so it 倾向低估tends to undercount(很多人没把全部技能写满)。但即便换成更严格的"物理硅 ∩ 模型"口径(把 CUDA / 编译器从金属侧剔除),梯度依然单调成立:博通 1.7% → NVIDIA 8.4% → d-Matrix 34%。 (many people never fill in all their skills). But even under a stricter "physical silicon ∩ model" scope (dropping CUDA / compilers from the metal side), the gradient still holds monotonically: Broadcom 1.7% → NVIDIA 8.4% → d-Matrix 34%.

换句话说:In other words: 绝对数会更高,相对排序不会变the absolute numbers go higher, the relative ranking doesn't move。谁更稀缺这件事,结论稳健。. On the question of who is scarcer, the conclusion is robust.

The Intel Foundry & The Bloodlines

04英特尔工厂,与每家公司的"血统"The Intel Factory, and every company's "lineage"

人从哪来?答案出乎意料地一致:Where do the people come from? The answer is surprisingly consistent: 英特尔Intel。它是 14 家公司里 9 家的头号人才来源——而且越是硬核的硅片初创,英特尔的占比越高。AI 也许是英特尔输掉的战争,但这场战争的兵,很多是英特尔送出去的。. It is the #1 talent feeder for 9 of the other 14 companies — and the more hardcore the silicon startup, the higher Intel's share. AI may be the war Intel lost, but many of the soldiers fighting it were sent out by Intel.

各公司中"前英特尔"员工占比(占该公司工程研究人才)Share of "ex-Intel" employees by company (of that company's eng & research talent)

Rivos
32%
Tenstorrent
31%
d-Matrix
24%
Lightmatter
24%
AMD
21%
Cerebras
17%
NVIDIA
13%
Marvell
10%
高通Qualcomm
8%
"前英特尔"= 该公司在册工程研究人才里、履历中有过英特尔正式岗位的人(按人去重)。其中约 89% 在英特尔做的是技术岗——是真工程师,不是短期实习。数据来源 Metix AI"Ex-Intel" = among that company's current eng & research professionals, those whose history includes a formal Intel role (deduplicated by person). Of them, roughly 89% held technical roles at Intel — real engineers, not short internships. Source: Metix AI

英特尔之外,剩下 5 家"非英特尔血统"的公司各有出处——而且每一条都能在公开记录里印证。读懂血统,就知道该去哪挖哪种人:Beyond Intel, the remaining 5 "non-Intel-lineage" companies each have their own origin — and every one can be verified in the public record. Read the lineage and you know where to raid for which kind of engineer:

公司Company头号血统Top lineage占比Share公开印证Public verification
Groq前 NVIDIAEx-NVIDIA34%创始人来自 Google 初代 TPU,但工程班底是 NVIDIA 系——"创始人血统 ≠ 队伍血统"。The founder came from Google's first-gen TPU, but the engineering bench is NVIDIA-bred — "founder lineage ≠ team lineage."
SambaNova甲骨文 + SunOracle + Sun24% + 17%联合创始人 Rodrigo Liang 出身 Oracle / Sun 的 SPARC 处理器谱系,整支队伍带数据库硬件基因。Co-founder Rodrigo Liang comes from the SPARC-processor lineage at Oracle / Sun, and the whole team carries database-hardware DNA.
Rivos苹果Apple20%2022 年被苹果起诉挖角芯片团队、窃取 SoC 机密,2024 年初和解——数据精确印证了那批苹果硅片人。Sued by Apple in 2022 for poaching its chip team and stealing SoC secrets, settled in early 2024 — the data precisely confirms that cohort of Apple-silicon people.
Etched苹果 + 英特尔Apple + Intel16% + 13%哈佛辍学生 2022 年创办、造 Transformer 专用 ASIC(Sohu),靠挖苹果 / 英特尔硅片老兵补齐硬件。Founded in 2022 by Harvard dropouts to build a Transformer-specific ASIC (Sohu), filling out its hardware bench by poaching Apple / Intel silicon veterans.
AWS Annapurna亚马逊内部Internal Amazon54%Trainium / Inferentia 团队以内部转岗为主——云厂自研芯片是"内部造血",不是市场挖角。The Trainium / Inferentia team is driven mainly by internal transfers — a cloud provider's in-house chips are "grown from within," not poached from the market.
注意区分"挖角"与"并购"。Mind the difference between "poaching" and "M&A." 有些大厂的"人才来源"其实是收购:博通的头号来源是 VMware(11%,2023 年完成收购),AMD 的来源里有 Xilinx(2022 年收购)。这些是把人"买进来",不是从市场挖来的,解读流动时要单列,否则会把并购误读成挖人能力。Some giants' "talent sources" are really acquisitions: Broadcom's #1 source is VMware (11%, acquisition completed in 2023), and AMD's sources include Xilinx (acquired in 2022). These people were "bought in," not poached from the market; treat them separately when reading flows, or you'll mistake M&A for hiring prowess.
The Golden Handcuffs

05NVIDIA 的金手铐:进得多,出得少NVIDIA's Golden Handcuffs: lots in, little out

英特尔的人四散而出,NVIDIA 却几乎不漏人——它在别家的人才来源里普遍只占 5–9%(唯一例外是 Groq)。原因写在任期里:NVIDIA 美国核心的中位在职任期是Intel's people scatter outward; NVIDIA barely leaks anyone — as a talent source for other companies it generally accounts for only 5–9% (the lone exception being Groq). The reason is written in the tenure: the median current tenure of NVIDIA's U.S. core is 40 个月40 months, and 44% 的人已经待满 4 年。叠加 NVDA 在 2023–2025 年约十倍的涨幅,这是当下行业最硬的一副金手铐。 have already passed 4 years. Layer on NVDA's roughly 10x run across 2023–2025 — and these are the hardest golden handcuffs in the industry today.

NVIDIA 工程研究人才的在职任期分布(n≈11,894)Current-tenure distribution of NVIDIA's eng & research talent (n≈11,894)

<12 个月<12 months
13%
12–24 个月12–24 months
18%
24–48 个月24–48 months
25%
48 个月以上48+ months
44%
任期 = 当前 NVIDIA 岗位起始日 → 报告日期。横条按各档占比(合计 100%)。数据来源 Metix AITenure = current NVIDIA role start date → report date. Bars show each band's share (totaling 100%). Source: Metix AI

可挖的,是 <24 个月那 31%What's poachable is the 31% under 24 months

Roughly 3,700 人3,700 people入职不到两年,初始 RSU 远未归属完——跳槽放弃的账面收益最小,是 NVIDIA 阵营里最现实的挖角窗口。越往 48 个月以上走,金手铐越紧:那 44%(约 5,200 人)手里是已大幅 in-the-money 的归属股票,几乎撬不动。 have been on board under two years, their initial RSUs far from fully vested — they forfeit the least paper gains by jumping, making them the most realistic poaching window in the NVIDIA camp. The further you go past 48 months, the tighter the handcuffs: that 44% (~5,200 people) hold deeply in-the-money vested stock and are nearly impossible to pry loose.

初创的打法正好相反Startups play it exactly the other way

Etched(中位任期 12 月)、Tenstorrent(16 月)、Lightmatter(17 月)都很"新"——它们用Etched (median tenure 12 mo), Tenstorrent (16 mo) and Lightmatter (17 mo) are all very "young" — they use 未上市股权pre-IPO equity反向操作:趁人还没在大厂 vesting 满之前撬出来,用上市前的期权对赌,去换大厂那份已经兑现的确定性。 to run the reverse play: pry people out before they fully vest at a giant, betting pre-IPO options against the giant's already-realized certainty.

口径诚实说明。An honest note on methodology. 数据库里The database has 没有薪酬数字no compensation figures。本节用"在职任期 × 公开股价表现"作为薪酬锁定结构(vesting / 金手铐)的可见代理,不是工资本身。NVDA 涨幅为公开市场信息,用于解释锁定强度,非本库数据。. This section uses "current tenure × public stock performance" as a visible proxy for the comp-lock structure (vesting / golden handcuffs), not for pay itself. The NVDA move is public-market information used to explain lock-in strength, not data from this database.
The Recruiter Playbook

06猎人画像与实操指南Hunter Profile & Field Playbook

把上面的结构翻译成可执行的源人动作。三件事先记住:这是一场用Translate the structure above into executable sourcing moves. Remember three things first: this is a war fought with 老兵veterans打的仗、要按, you source by 偏硅 / 偏模型metal / model标签分赛道找人、时机决定能不能撬动。 tags split into lanes, and timing decides whether you can pry someone loose.

都是老兵,不是应届All veterans, no new grads

全图中位履历The full-map median career is 13–22 年13–22 years;连最年轻的 Etched 也有 12.5 年,博通甚至 21.8 年。算力战是用资深工程师打的——别拿"招应届"的预算和话术来打这个市场。; even the youngest, Etched, sits at 12.5 years, and Broadcom is as high as 21.8. The compute war is fought with senior engineers — don't bring a "new-grad hiring" budget and pitch to this market.

按 metal / model 标签源人Source by metal / model tags

Want 纯硅片设计pure silicon design(RTL / 物理设计 / 验证)→ 去 Rivos(偏硅 87%)、Tenstorrent(85%)、Lightmatter(78%)、Etched(77%)。 (RTL / physical design / verification) → go to Rivos (metal-leaning 87%), Tenstorrent (85%), Lightmatter (78%), Etched (77%).
Want 编译器 / ML 系统Compilers / ML systems→ 去 AWS Annapurna、d-Matrix(偏模型 59%)、SambaNova(45%)、Cerebras(40%)。 → go to AWS Annapurna, d-Matrix (model-leaning 59%), SambaNova (45%), Cerebras (40%).

博士浓度决定话术PhD density shapes the pitch

要研究底子(光子 / 模拟 / 编译)→ Lightmatter(博士 30.6%)、d-Matrix(22.7%)、英特尔(20.1%)。Want a research foundation (photonics / analog / compilers) → Lightmatter (PhD 30.6%), d-Matrix (22.7%), Intel (20.1%).
要工程交付型、不必要博士 → SambaNova(6.7%)、Groq(6.8%)、Etched(8.5%)。Want delivery-focused engineers where a PhD isn't necessary → SambaNova (6.7%), Groq (6.8%), Etched (8.5%).

一句话作战图。The battle map in one line. 想要稀缺的双栈桥梁人,盘子其实在 NVIDIA / 英特尔 / AMD 内部(94% 在大厂)——If you want the scarce dual-stack bridge people, the pool actually sits inside NVIDIA / Intel / AMD (94% are at the giants) — 挖 NVIDIA 就盯 <24 个月那层、挖英特尔则全期可下手to raid NVIDIA target the <24-months layer, to raid Intel go after any tenure(它本来就在漏人);初创补硬件去 Rivos / Tenstorrent 系、补模型去 Annapurna / d-Matrix 系;用未上市股权赶在对方 vesting 满之前下手。读血统、看任期、分标签——剩下的就是速度。 (it's already leaking people); to fill hardware go to the Rivos / Tenstorrent group, to fill the model side go to the Annapurna / d-Matrix group; use pre-IPO equity and move before the other side fully vests. Read the lineage, watch the tenure, split by tags — the rest is speed.

想要这 56,861 人里的某一类——的完整名单?Want the full list of a specific slice of these 56,861 people?

本报告是聚合透视;落到具体人,Metix AI 可按"双栈 / 偏硅 / 偏模型 + 公司 + 任期窗口"筛出可对接的候选人名单,也可为任意目标公司生成同款人才 X 光。This report is an aggregate x-ray; to get down to named individuals, Metix AI can filter a contactable candidate list by "dual-stack / metal-leaning / model-leaning + company + tenure window," and can generate the same talent x-ray for any target company.

聚合报告 · 不展示任何个人信息 · 由 Metix AI · Mira 提供Aggregate report · no personal information shown · provided by Metix AI · Mira
口径说明:本报告基于 Metix AI 全球人才库,统计对象为 15 家美国 AI 算力 / 芯片公司的在册工程与研究人才(按权威 company_id 取在职、按硬件 + ML 系统岗位口径清洗),数据时点约 2026 H1。"双栈"为基于自报头衔 + 技能的关键词识别口径,倾向低估;云厂自研芯片仅 AWS Annapurna 可按独立主体识别,Google TPU / 微软 Maia / Meta MTIA 无法从母公司拆出,仅作流动背景。数字为可见样本的聚合口径,仅供参考;报告不展示任何个人姓名、联系方式或敏感属性。Methodology note: This report is based on the Metix AI global talent database. The population is current engineering and research professionals at 15 U.S. AI-compute / chip companies (current employees pulled by authoritative company_id, cleaned to a hardware + ML systems role scope), with data as of roughly 2026 H1. "Dual-stack" is a keyword-identification scope based on self-reported titles + skills and tends to undercount; among cloud in-house chips, only AWS Annapurna can be identified as a standalone entity — Google TPU / Microsoft Maia / Meta MTIA cannot be carved out from their parents and serve only as flow context. Figures are an aggregate scope over the visible sample, for reference only; the report displays no personal names, contact details or sensitive attributes.
Metix AI · Mira | AI 算力与芯片人才地图 2026 | 2026-06-16Metix AI · Mira | AI Compute & Chip Talent Map 2026 | 2026-06-16 Talent analytics powered by Metix AI